The Power Sources Manufacturers Association (PSMA) has released its Phase IV 3D Power Packaging Report, a comprehensive technology study focused on embedded and integrated magnetics (see Figure 1). Building on three previous phases that explored passive embedding and substrate technologies, this installment zeroes in on magnetics embedded in PCBs, integrated within IC packages, and fabricated directly on semiconductor dies.
This 260-page report, prepared by the Tyndall National Institute with input from global industry and academic experts, provides a detailed survey of the state of the art, emerging materials, fabrication processes, industry case studies, and future roadmaps. For the power electronics community, the findings are particularly timely: rising demand for AI servers, datacenters, advanced CPUs/ GPUs, and IoT systems is pushing power delivery networks (PDNs) to new limits. Integrated magnetics are no longer just a research curiosity; they are becoming essential enablers of next-generation power systems.
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