President's Message: September 2019

Frede Blaabjerg 2019

Carving Strategies to Effectively Serve the Global Membership

 by Frede Blaabjerg

Human life is always moving in waves. Sometimes it is calm, and sometimes it is quite hectic and hectic and busy when many issues must be confronted. The last few months (May to July) have been very busy for the IEEE Power Electronics Society (PELS). Although most of the time it was good, there were also some challenges. Read More...


Upcoming Events

A Review of Advanced Power Module Packaging and Thermal Management in WBG Era by Fang Luo

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FANG LUOAbstract: Wide Bandgap (WBG) devices with superior performance over traditional silicon power devices have become the prime candidates for future high-performance power electronics energy conversion. Traditional device packaging starts turning into a limiting factor in fully realizing the benefits offered by WBG power devices, and thus, improved and advanced packaging structures are required to bridge the gap between WBG devices and their applications. This talk provides a review of the state-of-art advanced module packaging technologies for SiC and GaN devices with the focuses on module layout, packaging material system, and module integration trend, and potential thermal management solutions in these WBG power electronics systems.

Missed a PELS webinar?

Don't worry- you can watch them on demand or view the slides, Visit the PELS Resource Center! 

Catch up on:
  • Designing reliable and high-density power solutions with GaN
  • How to publish research in the IEEE Transactions and Journals
  • Current sharing technologies for LLC resonant converters

  • Technology Development from the More Electric Aircraft to All Electric Flight

  • Design for reliability in power electronic based renewables 
  • Resilient and Sustainable Distribution Systems with Advanced Microgrids 

  • Big data gets physical

  • and more!

Visit: PELS Resource Center