President's Message: September 2019
by Frede Blaabjerg
Human life is always moving in waves. Sometimes it is calm, and sometimes it is quite hectic and hectic and busy when many issues must be confronted. The last few months (May to July) have been very busy for the IEEE Power Electronics Society (PELS). Although most of the time it was good, there were also some challenges. Read More...
2020 Member at Large Election Open!
The IEEE Power Electronics Society election of Members-at-Large to the Administrative Committee is now...
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2020 International Future Energy Challenge College Student Competition...
Call for Papers: PEDG 2020 - June 8th - 11th in Dubrovnik, Croatia
You can download original Call for Papers in PDF format here. SUBMISSION Prospective participants are...
Call for Papers: EPE 2020, Lyon France
MORE INFORMATION- CALL FOR PAPERS HERE The Power Electronics community will gather in Lyon, France,...
ECCE 2021 Logo Design Competition - Let your idea become our memory
Your talent beyond energy conversion! The inaugural ECCE Logo Design Competition has received 18...
PRESS RELEASE: IEEE’s Empower A Billion Lives Competition Tackles Global Energy Poverty
IEEE's Empower A Billion Lives Competition Tackles Global Energy Poverty International teams...
PELS Meetings and Events at SPEC/COBEP 2019
PELS Chapter Chair Forum @SPEC/COBEP 2019 PELS would like to invite the PELS Chapter Chars to...
APEC 2020- Registration is OPEN
Registration is Open for APEC 2020 You’re invited to the leading power electronics event, APEC 2020,...
PELS Member Townhall Meeting at ECCE-NA 2019
Mark your calendar and tune in on Sept 29th for a live stream event!Please join PELS Leaders as we...
YP Reception at ECCE-NA 2019
Are you a student or a young professional? You are cordially invited to attend the IAS-PELS Young...
PELS Mentorship Roundtable at ECCE-NA 2019
Event: PELS Mentorship Roundtable at ECCE-NA 2019 Date and Time: Tuesday, 1 October at...
Women in Engineering Breakfast at ECCE-NA 2019
Join us for the WIE Breakfast, where our speakers are prominent women in power electronics and...
IEEE Design Automation for Power Electronics (DAPE) Workshop
IEEE DAPE Workshop September 6, 2019, Magazzini Del Cotone Conference Center, Genova, Italy,...
A Review of Advanced Power Module Packaging and Thermal Management in WBG Era by Fang Luo
- Tues., Nov., 12, 2019 11:00 AM EDT
Abstract: Wide Bandgap (WBG) devices with superior performance over traditional silicon power devices have become the prime candidates for future high-performance power electronics energy conversion. Traditional device packaging starts turning into a limiting factor in fully realizing the benefits offered by WBG power devices, and thus, improved and advanced packaging structures are required to bridge the gap between WBG devices and their applications. This talk provides a review of the state-of-art advanced module packaging technologies for SiC and GaN devices with the focuses on module layout, packaging material system, and module integration trend, and potential thermal management solutions in these WBG power electronics systems.
Missed a PELS webinar?
Don't worry- you can watch them on demand or view the slides, Visit the PELS Resource Center!
- Designing reliable and high-density power solutions with GaN
- How to publish research in the IEEE Transactions and Journals
Current sharing technologies for LLC resonant converters
Technology Development from the More Electric Aircraft to All Electric Flight
- Design for reliability in power electronic based renewables
Resilient and Sustainable Distribution Systems with Advanced Microgrids
Big data gets physical
- and more!
Visit: PELS Resource Center