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Transactions on Power Electronics

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IEEE Transactions on Power Electronics

About the Publication

The IEEE Transactions on Power Electronics (TPEL) is a monthly publication where papers are available in Xplore shortly after acceptance. TPEL’s scope includes new results in the field of power electronics. For example, papers that treat original components, devices, modules, circuits, control, system, or application issues are of interest. Papers that do not show sufficient overlap with interest in the power electronics field (e.g., device physics, component manufacturing technologies, and circuit theory) should be submitted to other IEEE Transactions that cover these fields. Papers of a historical or tutorial nature within the scope of this publication will also be considered.

For those who are researchers in the power electronics industry or aspiring to a university career, establishing a publications portfolio is essential. Getting published in the prestigious TPEL will help elevate a career to new heights!

For more information, please contact Editor in Chief Yaow-Ming Chen.

Open Calls for Papers


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Publication Details


Information for Authors

Information on paper submission (e.g., correct formats, file types, etc.) can be found in TPEL’s submission guidelines. All submissions should be in a double-column format. The correct template can be found in the IEEE Template Selector. Authors should pay particular attention to documenting their work in relation to the known literature. For more information concerning tools and assistance with article preparation and submission, the proof review process, and ordering reprints, please visit the IEEE Author Center.

The articles in TPEL are peer-reviewed in accordance with the requirements set forth in the IEEE PSPB Operations Manual (sections 8.2.1.C & 8.2.2.A). Each published article was reviewed by a minimum of two independent reviewers using a single-blind peer-review process, where the identities of the reviewers are not known to the authors, but the reviewers know the identities of the authors. Articles will be screened for plagiarism before acceptance.

Active Content, Multimedia, and Graphic Abstracts: TPEL encourages authors to submit Active Content/Multimedia files (e.g., movies, simulation files, PowerPoints, etc.) with their papers if they believe the files will enhance the quality of the manuscript. All materials should be uploaded together at the time of submission. For more information, please read TPEL’s Active Content/Multimedia Instructions.

Institiutional Emails: Starting September 1, 2023, there will be a change in the submission requirements for TPEL. This measure is to protect our authors. It will be mandatory that all submissions have a primary email address that is institutional. Examples of institutional emails include those from an academic institution, a government agency, a company, or IEEE. Papers that do not meet this requirement will not be entered into the review process. We thank you for your assistance with this submission update.

Submit a Paper

  1. Special Section on Advanced MV Power Electronics for Grid Interactive Applications Call for Papers
  2. Special Section on Advancing Power Electronics Reliability: Components, Systems, and Intelligent Operation Call for Papers
  3. Special Section on Ultrawide/Wide Bandgap Device, Packaging, Control, EMI, and Applications for Power Electronics
    Call for Papers page 1Call for Papers page 2

Editorial Board

Position Name Affiliation (Country)
Editor in Chief Yaow-Ming Chen Natl. Taiwan Univ. (Taiwan)
Co-Editor in Chief J. Marcos Alonso Univ. de Oviedo (Spain)
Paolo Mattavelli Univ. of Padova (Italy)
Giovanna Oriti Naval Postgraduate School (USA)
Chun T. Rim GIST (Korea)
Maryam Saeedifard Georgia Inst. of Tech. (USA)
Dianguo Xu Harbin Inst. of Tech. (China)
Navid Zargari Rockwell Automation (Canada)
Editor at Large Sudip Mazumder Univ. of Illinois, Chicago (USA)
Executive Editor, Letters Xiongfei Wang KTH Royal Institute of Technology (Sweden)
Co-Editor in Chief, Letters Vivek Agarwal Indian Inst. of Tech., Bombay (India)
Brendan McGrath RMIT University, Australia
Xinke Wu Zhejiang University, China
Associate Editors Jesus Acero Univ. of Zaragoza (Spain)
Kan Akatsu Shibaura Inst. of Tech. (Japan)
Mahshid Amirabadi Northeastern Univ. (USA)
Michael Andersen Tech. Univ. of Denmark (Denmark)
Francisco Azcondo Univ. of Cantabria (Spain)
Ebrahim Babaei Univ. of Tabriz (Iran)
A. Barrado Univ. Carlos III de Madrid (Spain)
Kaushik Basu Indian Inst. of Sci., Bangalore (India)
A. M. Bazzi Univ. of Connecticut (USA)
Juergen Biela ETH-Zurich (Switzerland)
Mohammad Tavakoli Bina K.N. Toosi Univ. of Tech. (Iran)
Wen Cao Aston Univ. (UK)
Liuchen Chang Univ. of New Brunswick (Canada)
H. Chaoui Carleton University, Ottawa, ON (Canada)
Ching-Jan Chen Natl. Taiwan Univ. (Taiwan)
Ke-Horng Chen Natl. Chiao Tung Univ. (Taiwan)
Minjie Chen Princeton Univ. (USA)
Zhe Chen Aalborg Univ. (Denmark)
Henry Shu-Hung Chung City Univ. of Hong Kong (Hong Kong)
Jon Clare Nottingham Univ. (UK)
Luca Corradini Univ. of Padova (Italy)
Francois Costa Univ. of Paris East Creteli (France)
Daniel Costinett Univ. of Tennessee (USA)
Ali Davoudi Univ. of Texas, Arlington (USA)
Giulio De Donato Sapienza-Univ. of Rome (Italy)
Frans Dijkhuizen Hitachi Energy Research (Sweden)
Christina DiMarino Virginia Tech (USA)
Dong Dong Virginia Tech (USA)
Maeve Duffy Natl. Univ. of Ireland, Galway (Ireland)
Drazen Dujic Ecole Polytechnique Federale de Lausanne (Switzerland)
Mohamed El Moursi Khalifa Univ. of Sci. and Tech. (USA)
Mehdi Ferdowsi Missouri Univ. of Sci. and Tech. (USA)
BG Fernandes Indian Inst. of Tech., Bombay (India)
Cristina Fernandez Univ. Carlos III de Madrid (Spain)
Francisco Freijedo Huawei Technologies (Germany)
Friedrich Fuchs Christian-Albrechts-Univ. of Kiel (Germany)
Feng Gao Shandong Univ. (China)
Herbert Ginn Univ. of South Carolina (USA)
Saeed Golestan Aalborg Univ. (Denmark)
Amit Gupta Rolls-Royce Singapore PTE Ltd. (Singapore)
Kosala Gunawardane University of Technology Sydney (Australia)
Makoto Hagiwara Tokyo Inst. of Tech. (Japan)
Michael Hartmann Schneider Electric (Austria)
JiangBiao He Univ. of Kentucky (USA)
Jinwei He Tianjin Univ. (China)
Carl Ho Univ. of Manitoba (Canada)
Heath Hofmann Univ. of Michigan, Ann Arbor (USA)
Wenkang Huang Infineon Technologies (USA)
Shu-Yuen (Ron) Hui Univ. of Hong Kong (Hong Kong)
Jin Hur Incheon National University (Korea)
N.R.N. Idris Univ. Teknologi Malaysia (Malaysia)
Adrian Ioinovici Nanjing Univ. of Aeronautics and Astronautics (China)
Junichi Itoh Nagaoka Univ. of Tech. (Japan)
Ho-ching (Herbert) Iu Univ. of Western Australia (Australia)
Lakshmi Varaha Iyer Magna International Inc. (USA)
Santanu Kapat Indian Inst. of Tech., Kharagpur (India)
Ralph Kennel Technische Univ. Muenchen (Germany)
Sayed Ali Khajehoddin Univ. of Alberta (Canada)
Katherine Kim Natl. Taiwan Univ. (Taiwan)
Georgios Konstantinou Univ. of New South Wales (Australia)
Harish Krishnamoorthy Univ. of Houston (USA)
Alon Kuperman Ben-Gurion Univ. of the Negev (Israel)
John Lam York Univ. (Canada)
Chi-Kwan Lee Univ. of Hong Kong (Hong Kong)
Dong-Choon Lee Yeungnam Univ. (Korea)
Kyo-Beum Lee Ajou Univ. (Korea)
B. Li Harbin Institute of Technology (China)
Hong Li Beijing Jiaotong Univ (China)
Qiang Li Virginia Tech (USA0
Yuan Li Florida State Univ. (USA)
Zixin Li Chinese Academy of Sci. (China)
Tsorng-Juu (Peter) Liang Natl. Cheng-Kung Univ. (Taiwan)
Faa-Jeng Lin Natl. Central Univ. (Taiwan)
Ray-Lee Lin Natl. Cheng-Kung Univ. (Taiwan)
Andreas Lindemann Otto-von-Guericke-Univ. Magdeburg (Germany)
Marco Liserre Christian-Albrechts-Uni. zu Kiel (Germany)
Jinjun Liu Xi’an Jiaotong Univ. (China)
Oscar Lucia Univ. of Zaragoza (Spain)
Fang Luo SUNY, Stony Brook (USA)
Ke Ma Shanghai Jiao Tong Univ. (China)
Antonio Marques Cardoso Univ. of Beira Interior (Portugal)
Brendan McGrath RMIT Univ. (Australia)
Saad Mekhilef Univ. of Malaya (Malaysia)
Behrooz Mirafzal Kansas State Univ. (USA)
Tomokazu Mishima Kobe Univ. (Japan)
Santanu Mishra Indian Inst. of Tech., Kanpur (India)
Yasser Mohamed Univ. of Alberta (Canada)
Marta Molinas Norweigan Univ. of Sci. and Tech. (Norway)
Gerry Moschopoulos Western Univ. (Canada)
M. Naramani McMaster Univ. (Canada)
Muhammad Nawaz ABB Corp. Research (Sweden)
Dorin Neacsu Tech. Univ. of Iasi (Romania)
Khai Ngo Virginia Tech (USA)
Martin Ordonez Univ. of British Columbia (Canada)
Sanjib Panda Natl. Univ. of Singapore (Singapore)
Ki-Bum Park KAIST (Korea)
X. Pei University of Bath (UK)
Han Peng Huazhong Univ. of Sci. and Tech. (China)
Li Peng Huazhong Univ. of Sci. and Tech. (China)
Mario Ponce-Silva CENIDET (Mexico)
Jelena Popovic Klimop Energy (Netherlands)
Ting Qian Tongji Univ. (China)
Dongyuan Qiu South China Univ. of Tech. (China)
Xiaohui Qu Southeast Univ. (China)
Jacek Rabkowski Warsaw Univ. of Tech. (Poland)
Xinbo Ruan Nanjing Univ. of Aeronautics and Astronautics (China)
Alireza Safaee Apple, Inc. (USA)
Mark Scott Miami Univ. (USA)
Gab-Su Seo Natl. Renewable Energy Lab. (USA)
Q. Shafiee Univ. of Kurdistan (Iran)

B. Shao

Sillumin Semiconductor Inc. (USA)
Miaosen Shen Lucid Motors (USA)
Kuang Sheng Zhejiang Univ. (China)
Tingna Shi Zhejiang Univ. (China)
Bhim Singh Indian Inst. of Tech., Delhi (India)
Yam Siwakoti Univ. of Tech. Sydney (Australia)
Ilhem Slama-Belkhodja Univ. de Tunis El Manar (Tunisia)
Mei Su Central South Univ. (China)
Kai Sun Tsinghua Univ. (China)
Nadia M. L. Tan University of Nottingham, Ningbo (China)
Yi Tang Nanyang Tech. Univ. (Singapore)

S. Tian

Innoscience America, Inc. (USA)
Oliver Trescases Univ. of Toronto (Canada)
Andrzej Trzynadlowski Univ. of Nevada (USA)
Chi (Michael) Tse Hong Kong Polytechnic Univ. (Hong Kong)
Dmitri Vinnikov TalTech Univ. (Estonia)
Massimo Vitelli Univ. degli Studi della Campania Luigi Vanvitelli (Italy)
Keiji Wada Tokyo Metropolitan Univ. (Japan)
Fred Wang Univ. of Tennessee (USA)
Huai Wang Aalborg Univ. (Denmark)
Jin Wang Ohio State Univ. (USA)
Laili Wang Xi’an Jiaotong Univ. (China)
M. Wang University of Michigan-Dearborn (USA)
Sheldon Williamson Univ. of Ontario Inst. of Tech. (Canada)
Xinke Wu Zhejiang Univ. (China)
Yan Xing Nanjing Univ. of Aeronautics and Astronautics (China)
Mark Dehong Xu Zhejiang Univ. (China)
Yaosuo (Sonny) Xue Oak Ridge Natl. Lab. (USA)
Yingyi Yan Analog Devices (USA)
Shih-Chen Yang Natl. Taiwan Univ. (Taiwan)
Yongheng Yang Zhejiang Univ. (China)
Amirnaser Yazdani Ryerson Univ. (Canada)
Jin Ye Univ. of Georgia (USA)
Di Zhang GE Global Research (USA)
Li Zhang Leeds Univ. (UK)
L.Z. Zhang Shandong Univ. (China)
Zheyu Zhang Clemson Univ. (USA)

Power Electronics Letters

The IEEE Transactions on Power Electronics covers all issues of widespread or generic interest to engineers who work in the field of power electronics. The Journal editors will enforce standards and a review policy equivalent to the IEEE Transactions, and only papers of high technical quality will be accepted. Papers which treat new and novel device, circuit or system issues which are of generic interest to power electronics engineers are published. Papers which are not within the scope of this Journal will be forwarded to the appropriate IEEE Journal or Transactions editors. Examples of papers which would be more appropriately published in other Journals or Transactions include:

  1. Papers describing semiconductor or electron device physics. These papers would be more appropriate for the IEEE Transactions on Electron Devices.
  2. Papers describing applications in specific areas: e.g., industry, instrumentation, utility power systems, aerospace, industrial electronics, etc. These papers would be more appropriate for the Transactions of the Society which is concerned with these applications.
  3. Papers describing magnetic materials and magnetic device physics. These papers would be more appropriate for the IEEE Transactions on Magnetics.
  4. Papers on machine theory. These papers would be more appropriate for the IEEE Transactions on Power Systems. While original papers of significant technical content will comprise the major portion of the Journal, tutorial papers and papers of historical value are also reviewed for publication.

Awards & Recognitions

Each year, the Editors and Associate Editors of TPEL recognize first place prize papers and second place prize papers deemed best among those published in TPEL during the preceding calendar year.

For information on this award, including eligibility, criteria, award items, and past recipients, please visit the Transactions on Power Electronics (TPEL) Prize Paper Award page.

Contact Information

Proposals for the special sections should be emailed to the TPEL Admin.

For more on the special sections, contact the TPEL Admin.

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