TC 2: Power Components, Integration, and Power ICs

TC 2 organizes the following events:

• Capacitor Workshop: This event (which is held on the Saturday before the Applied Power Electronics Conference and Exposition (APEC)) brings together experts from academia, industry, and design engineering to share the latest advancements in capacitor technology.  Participants also receive practical advice to help them optimize capacitor performance in their products and applications.
• IEEE International Workshop on Integrated Power Packaging (IWIPP): This biennial workshop brings together a multidisciplinary community to promote the advancement of power semiconductor packaging, which is widely considered to represent the key to unlocking next-generation power electronic applications. Technical content covers a broad range of topics, including manufacturing and semiconductor integration, materials, power module design, reliability and thermal management, semiconductors and passive components, and system integration.
• IEEE International Workshop on Power Supply On Chip (PwrSoC):  This biennial workshop addresses a range of technologies, covers modular and granular electronic power converters for multiple applications, and focuses on integrating electrical power converters for various applications. The complete integration on-die and integration within a package are of prime interest.
• Power Magnetics at High Frequency Workshop: This annual workshop takes place on the day before APEC and focuses on necessary advancements (as identified by the participants) for power magnetics to meet the technical challenges of new market applications that require higher operating frequencies and emerging topologies, enabled by ongoing progress in circuit design and semiconductor devices.  The presentations focus on recent developments of magnetic materials, winding design, construction methods, evaluation techniques, modeling, and simulation tools and foster dialogue that drives continuous advancement and improvement.