Solid‑State Transformer for AIDC: Research and Industry Status, Insulation Technology and Future Development

Date: 26/11/2026
Time: 8:00 am
Presenter: Chushan Li
Abstract: (This webinar is sponsored by PELS TC 12) Driven by advances in artificial intelligence, massive computing power demands have emerged, accelerating the construction of Artificial Intelligence Data Centers (AIDC) and triggering a new round of global power‑system construction. Power consumption of data centers has grown explosively. Traditional data‑center power supply architectures, which adopt power‑frequency transformers for isolation and step‑down, low‑voltage AC power distribution and multi‑stage power conversion, cannot meet the high‑energy‑efficiency and high‑density design requirements for energy‑intensive AIDCs. Power supply has become a critical bottleneck restricting computing‑power improvement. High‑density high‑capacity solid‑state transformers, which realize high‑frequency isolated power conversion from medium‑voltage AC to low‑voltage DC, represent the ultimate solution for performance leap of data‑center power supply systems, and have become one of the hottest research topics in the power‑supply industry. Based on sorting out the application requirements of AIDC, this seminar reviews academic and industrial progress of solid‑state transformer technology. It presents ongoing research work and technical prospects in two aspects. First, it introduces the insulation design philosophy of solid‑state transformers adopting double‑shielding structures, and provides design cases for key isolation components of solid‑state transformers such as high‑frequency transformers based on double‑shielding schemes. Second, targeting future large‑capacity 35 kV grid‑connection requirements, it presents feasible new insulation and topology solutions for solid‑state transformers, and analyzes critical technical bottlenecks to be overcome for reliable 35 kV grid access.
Chushan Li received the B.E.E. degree and Ph.D. degree from the Department of Electrical Engineering, Zhejiang University, Hangzhou, China, in 2008 and 2014, respectively. From December 2013 to June 2014, he was a research assistant in Hong Kong Polytechnic University. From July 2014 to July 2017, he was a postdoctoral fellow in Department of Electrical and Computer Engineering, Ryerson University, Canada. Currently, he is an Associate professor in Zhejiang University – University of Illinois at Urbana-Champaign Institute, Zhejiang University, Haining, China, and Adjunct Professor at the University of Illinois Urbana‑Champaign. His research focuses on medium‑voltage high‑capacity power conversion topologies and control, as well as multi‑physics modeling and analysis. He has published 126 SCI/EI‑indexed papers, with H‑index of 25. He holds 3 US patents and 42 Chinese patents. He serves as Associate Editor for journals including IEEE OJPE and IET PE, and Secretary‑General of the Academic Committee of China Power Supply Society, and Program Chair of 2025 IEEE 3rd International Power Electronics and Application Symposium (IEEE PEAS 2025), 2024 IEEE International Symposium on Energy Storage and Conversion Systems (IEEE ISESC 2024); Organizing Committee Chair of 2022 IEEE Transportation Electrification Conference and Expo, Asia‑Pacific (IEEE ITEC‑AP 2022).