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Transactions on Power Electronics

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IEEE Transactions on Power Electronics

About the Publication

The IEEE Transactions on Power Electronics (TPEL) is a monthly publication where papers are available in Xplore shortly after acceptance. TPEL’s scope includes new results in the field of power electronics. For example, papers that treat original components, devices, modules, circuits, control, system, or application issues are of interest. Papers that do not show sufficient overlap with interest in the power electronics field (e.g., device physics, component manufacturing technologies, and circuit theory) should be submitted to other IEEE Transactions that cover these fields. Papers of a historical or tutorial nature within the scope of this publication will also be considered.

For those who are researchers in the power electronics industry or aspiring to a university career, establishing a publications portfolio is essential. Getting published in the prestigious TPEL will help elevate a career to new heights!

For more information, please contact Editor in Chief Yaow-Ming Chen.

Open Calls for Papers

6.7

Impact Factor

14.1

CiteScore

- weeks

Time to Publication
Publication Details

Further
Information

Information for Authors

Information on paper submission (e.g., correct formats, file types, etc.) can be found in TPEL’s submission guidelines. All submissions should be in a double-column format. The correct template can be found in the IEEE Template Selector. Authors should pay particular attention to documenting their work in relation to the known literature. For more information concerning tools and assistance with article preparation and submission, the proof review process, and ordering reprints, please visit the IEEE Author Center.

The articles in TPEL are peer-reviewed in accordance with the requirements set forth in the IEEE PSPB Operations Manual (sections 8.2.1.C & 8.2.2.A). Each published article was reviewed by a minimum of two independent reviewers using a single-blind peer-review process, where the identities of the reviewers are not known to the authors, but the reviewers know the identities of the authors. Articles will be screened for plagiarism before acceptance.

Active Content, Multimedia, and Graphic Abstracts: TPEL encourages authors to submit Active Content/Multimedia files (e.g., movies, simulation files, PowerPoints, etc.) with their papers if they believe the files will enhance the quality of the manuscript. All materials should be uploaded together at the time of submission. For more information, please read TPEL’s Active Content/Multimedia Instructions.

Institiutional Emails: Starting September 1, 2023, there will be a change in the submission requirements for TPEL. This measure is to protect our authors. It will be mandatory that all submissions have a primary email address that is institutional. Examples of institutional emails include those from an academic institution, a government agency, a company, or IEEE. Papers that do not meet this requirement will not be entered into the review process. We thank you for your assistance with this submission update.

Submit a Paper

https://mc.manuscriptcentral.com/tpel-ieee

  1. Special Section on Advanced MV Power Electronics for Grid Interactive Applications Call for Papers
  2. Special Section on Advancing Power Electronics Reliability: Components, Systems, and Intelligent Operation Call for Papers
  3. Special Section on Ultrawide/Wide Bandgap Device, Packaging, Control, EMI, and Applications for Power Electronics
    Call for Papers page 1Call for Papers page 2

Editorial Board

PositionNameAffiliation (Country)
PositionNameAffiliation (Country)
Editor in ChiefYaow-Ming ChenNatl. Taiwan Univ. (Taiwan)
Co-Editor in ChiefJ. Marcos AlonsoUniv. de Oviedo (Spain)
Paolo MattavelliUniv. of Padova (Italy)
Giovanna OritiNaval Postgraduate School (USA)
Chun T. RimGIST (Korea)
Maryam SaeedifardGeorgia Inst. of Tech. (USA)
Dianguo XuHarbin Inst. of Tech. (China)
Navid ZargariRockwell Automation (Canada)
Editor at LargeSudip MazumderUniv. of Illinois, Chicago (USA)
Executive Editor, LettersXiongfei WangKTH Royal Institute of Technology (Sweden)
Co-Editor in Chief, LettersVivek AgarwalIndian Inst. of Tech., Bombay (India)
Brendan McGrathRMIT University, Australia
Xinke WuZhejiang University, China
Associate EditorsJesus AceroUniv. of Zaragoza (Spain)
Kan AkatsuShibaura Inst. of Tech. (Japan)
Mahshid AmirabadiNortheastern Univ. (USA)
Michael AndersenTech. Univ. of Denmark (Denmark)
Francisco AzcondoUniv. of Cantabria (Spain)
Ebrahim BabaeiUniv. of Tabriz (Iran)
A. BarradoUniv. Carlos III de Madrid (Spain)
Kaushik BasuIndian Inst. of Sci., Bangalore (India)
A. M. BazziUniv. of Connecticut (USA)
Juergen BielaETH-Zurich (Switzerland)
Mohammad Tavakoli BinaK.N. Toosi Univ. of Tech. (Iran)
Wen CaoAston Univ. (UK)
Liuchen ChangUniv. of New Brunswick (Canada)
H. ChaouiCarleton University, Ottawa, ON (Canada)
Ching-Jan ChenNatl. Taiwan Univ. (Taiwan)
Ke-Horng ChenNatl. Chiao Tung Univ. (Taiwan)
Minjie ChenPrinceton Univ. (USA)
Zhe ChenAalborg Univ. (Denmark)
Henry Shu-Hung ChungCity Univ. of Hong Kong (Hong Kong)
Jon ClareNottingham Univ. (UK)
Luca CorradiniUniv. of Padova (Italy)
Francois CostaUniv. of Paris East Creteli (France)
Daniel CostinettUniv. of Tennessee (USA)
Ali DavoudiUniv. of Texas, Arlington (USA)
Giulio De DonatoSapienza-Univ. of Rome (Italy)
Frans DijkhuizenHitachi Energy Research (Sweden)
Christina DiMarinoVirginia Tech (USA)
Dong DongVirginia Tech (USA)
Maeve DuffyNatl. Univ. of Ireland, Galway (Ireland)
Drazen DujicEcole Polytechnique Federale de Lausanne (Switzerland)
Mohamed El MoursiKhalifa Univ. of Sci. and Tech. (USA)
Mehdi FerdowsiMissouri Univ. of Sci. and Tech. (USA)
BG FernandesIndian Inst. of Tech., Bombay (India)
Cristina FernandezUniv. Carlos III de Madrid (Spain)
Francisco FreijedoHuawei Technologies (Germany)
Friedrich FuchsChristian-Albrechts-Univ. of Kiel (Germany)
Feng GaoShandong Univ. (China)
Herbert GinnUniv. of South Carolina (USA)
Saeed GolestanAalborg Univ. (Denmark)
Amit GuptaRolls-Royce Singapore PTE Ltd. (Singapore)
Kosala GunawardaneUniversity of Technology Sydney (Australia)
Makoto HagiwaraTokyo Inst. of Tech. (Japan)
Michael HartmannSchneider Electric (Austria)
JiangBiao HeUniv. of Kentucky (USA)
Jinwei HeTianjin Univ. (China)
Carl HoUniv. of Manitoba (Canada)
Heath HofmannUniv. of Michigan, Ann Arbor (USA)
Wenkang HuangInfineon Technologies (USA)
Shu-Yuen (Ron) HuiUniv. of Hong Kong (Hong Kong)
Jin HurIncheon National University (Korea)
N.R.N. IdrisUniv. Teknologi Malaysia (Malaysia)
Adrian IoinoviciNanjing Univ. of Aeronautics and Astronautics (China)
Junichi ItohNagaoka Univ. of Tech. (Japan)
Ho-ching (Herbert) IuUniv. of Western Australia (Australia)
Lakshmi Varaha IyerMagna International Inc. (USA)
Santanu KapatIndian Inst. of Tech., Kharagpur (India)
Ralph KennelTechnische Univ. Muenchen (Germany)
Sayed Ali KhajehoddinUniv. of Alberta (Canada)
Katherine KimNatl. Taiwan Univ. (Taiwan)
Georgios KonstantinouUniv. of New South Wales (Australia)
Harish KrishnamoorthyUniv. of Houston (USA)
Alon KupermanBen-Gurion Univ. of the Negev (Israel)
John LamYork Univ. (Canada)
Chi-Kwan LeeUniv. of Hong Kong (Hong Kong)
Dong-Choon LeeYeungnam Univ. (Korea)
Kyo-Beum LeeAjou Univ. (Korea)
B. LiHarbin Institute of Technology (China)
Hong LiBeijing Jiaotong Univ (China)
Qiang LiVirginia Tech (USA0
Yuan LiFlorida State Univ. (USA)
Zixin LiChinese Academy of Sci. (China)
Tsorng-Juu (Peter) LiangNatl. Cheng-Kung Univ. (Taiwan)
Faa-Jeng LinNatl. Central Univ. (Taiwan)
Ray-Lee LinNatl. Cheng-Kung Univ. (Taiwan)
Andreas LindemannOtto-von-Guericke-Univ. Magdeburg (Germany)
Marco LiserreChristian-Albrechts-Uni. zu Kiel (Germany)
Jinjun LiuXi’an Jiaotong Univ. (China)
Oscar LuciaUniv. of Zaragoza (Spain)
Fang LuoSUNY, Stony Brook (USA)
Ke MaShanghai Jiao Tong Univ. (China)
Antonio Marques CardosoUniv. of Beira Interior (Portugal)
Brendan McGrathRMIT Univ. (Australia)
Saad MekhilefUniv. of Malaya (Malaysia)
Behrooz MirafzalKansas State Univ. (USA)
Tomokazu MishimaKobe Univ. (Japan)
Santanu MishraIndian Inst. of Tech., Kanpur (India)
Yasser MohamedUniv. of Alberta (Canada)
Marta MolinasNorweigan Univ. of Sci. and Tech. (Norway)
Gerry MoschopoulosWestern Univ. (Canada)
M. NaramaniMcMaster Univ. (Canada)
Muhammad NawazABB Corp. Research (Sweden)
Dorin NeacsuTech. Univ. of Iasi (Romania)
Khai NgoVirginia Tech (USA)
Martin OrdonezUniv. of British Columbia (Canada)
Sanjib PandaNatl. Univ. of Singapore (Singapore)
Ki-Bum ParkKAIST (Korea)
X. PeiUniversity of Bath (UK)
Han PengHuazhong Univ. of Sci. and Tech. (China)
Li PengHuazhong Univ. of Sci. and Tech. (China)
Mario Ponce-SilvaCENIDET (Mexico)
Jelena PopovicKlimop Energy (Netherlands)
Ting QianTongji Univ. (China)
Dongyuan QiuSouth China Univ. of Tech. (China)
Xiaohui QuSoutheast Univ. (China)
Jacek RabkowskiWarsaw Univ. of Tech. (Poland)
Xinbo RuanNanjing Univ. of Aeronautics and Astronautics (China)
Alireza SafaeeApple, Inc. (USA)
Mark ScottMiami Univ. (USA)
Gab-Su SeoNatl. Renewable Energy Lab. (USA)
Q. ShafieeUniv. of Kurdistan (Iran)

B. Shao

Sillumin Semiconductor Inc. (USA)
Miaosen ShenLucid Motors (USA)
Kuang ShengZhejiang Univ. (China)
Tingna ShiZhejiang Univ. (China)
Bhim SinghIndian Inst. of Tech., Delhi (India)
Yam SiwakotiUniv. of Tech. Sydney (Australia)
Ilhem Slama-BelkhodjaUniv. de Tunis El Manar (Tunisia)
Mei SuCentral South Univ. (China)
Kai SunTsinghua Univ. (China)
Nadia M. L. TanUniversity of Nottingham, Ningbo (China)
Yi TangNanyang Tech. Univ. (Singapore)

S. Tian

Innoscience America, Inc. (USA)
Oliver TrescasesUniv. of Toronto (Canada)
Andrzej TrzynadlowskiUniv. of Nevada (USA)
Chi (Michael) TseHong Kong Polytechnic Univ. (Hong Kong)
Dmitri VinnikovTalTech Univ. (Estonia)
Massimo VitelliUniv. degli Studi della Campania Luigi Vanvitelli (Italy)
Keiji WadaTokyo Metropolitan Univ. (Japan)
Fred WangUniv. of Tennessee (USA)
Huai WangAalborg Univ. (Denmark)
Jin WangOhio State Univ. (USA)
Laili WangXi’an Jiaotong Univ. (China)
M. WangUniversity of Michigan-Dearborn (USA)
Sheldon WilliamsonUniv. of Ontario Inst. of Tech. (Canada)
Xinke WuZhejiang Univ. (China)
Yan XingNanjing Univ. of Aeronautics and Astronautics (China)
Mark Dehong XuZhejiang Univ. (China)
Yaosuo (Sonny) XueOak Ridge Natl. Lab. (USA)
Yingyi YanAnalog Devices (USA)
Shih-Chen YangNatl. Taiwan Univ. (Taiwan)
Yongheng YangZhejiang Univ. (China)
Amirnaser YazdaniRyerson Univ. (Canada)
Jin YeUniv. of Georgia (USA)
Di ZhangGE Global Research (USA)
Li ZhangLeeds Univ. (UK)
L.Z. ZhangShandong Univ. (China)
Zheyu ZhangClemson Univ. (USA)

Power Electronics Letters

The IEEE Transactions on Power Electronics covers all issues of widespread or generic interest to engineers who work in the field of power electronics. The Journal editors will enforce standards and a review policy equivalent to the IEEE Transactions, and only papers of high technical quality will be accepted. Papers which treat new and novel device, circuit or system issues which are of generic interest to power electronics engineers are published. Papers which are not within the scope of this Journal will be forwarded to the appropriate IEEE Journal or Transactions editors. Examples of papers which would be more appropriately published in other Journals or Transactions include:

  1. Papers describing semiconductor or electron device physics. These papers would be more appropriate for the IEEE Transactions on Electron Devices.
  2. Papers describing applications in specific areas: e.g., industry, instrumentation, utility power systems, aerospace, industrial electronics, etc. These papers would be more appropriate for the Transactions of the Society which is concerned with these applications.
  3. Papers describing magnetic materials and magnetic device physics. These papers would be more appropriate for the IEEE Transactions on Magnetics.
  4. Papers on machine theory. These papers would be more appropriate for the IEEE Transactions on Power Systems. While original papers of significant technical content will comprise the major portion of the Journal, tutorial papers and papers of historical value are also reviewed for publication.

Awards & Recognitions

Each year, the Editors and Associate Editors of TPEL recognize first place prize papers and second place prize papers deemed best among those published in TPEL during the preceding calendar year.

For information on this award, including eligibility, criteria, award items, and past recipients, please visit the Transactions on Power Electronics (TPEL) Prize Paper Award page.

Contact Information

Proposals for the special sections should be emailed to the TPEL Admin.

For more on the special sections, contact the TPEL Admin.

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