TC 11 Workshops

17 June 2022
West Anaheim Resort (Anaheim, CA, USA)

The Power Electronics for Aerospace Workshop Series (PEAS) - High Voltage is a one-day workshop co-organized by TC 11 and the 2022 IEEE/AIAA Transportation Electrification Conference and Electric Aircraft Technologies Symposium (ITEC+EATS).  PEAS aims to provide a forum for researchers, engineers, policymakers, and stakeholders to share the latest developments in power electronics technologies for aerospace applications.  This year’s workshop focuses on high voltage related topics, such as:

  • Dielectric materials characterization (e.g., dielectric spectroscopy, dielectric strength)
  • High-performance insulation materials (e.g., high operation temperature and dielectric strength) 
  • High-voltage cables and connectors
  • High-voltage testing techniques and standards 
  • Insulation condition monitoring, diagnostics, and maintenance
  • Insulation designs for power electronics converters (e.g., electric field grading techniques, overvoltage suppression, and insulation coordination)
  • Insulation material breakdown mechanisms (e.g., space charges in dielectrics)
  • Insulation reliability under extreme operation conditions (e.g., high altitude, high radiation, high temperature, and high DV/DT voltage pulse)
  • Preventions of partial discharge, treeing, breakdown and arc

Rationale: Power electronics systems for aerospace applications have unique design challenges to meet ultrahigh power density and reliability requirements under extreme operating conditions.  One critical aspect is the insulation of power electronics systems, including but not limited to temperature ruggedness and radiation hardness of insulation materials, size and weight reduction of insulation designs, high voltage suppression and insulation coordination, partial discharge mitigation at high altitude, arcing prevention, insulation testing technologies, etc.  This workshop will invite world‐renowned experts in high voltage engineering, insulation materials, power electronics circuits, semiconductor devices, device packaging, and system integration to present their latest research works and share their visions of developments in this emerging field.  The workshop aims to provide a unified platform for associated researchers and engineers to exchange ideas and formulate short-term and long-term research directions.

Contacts: Dr. Jin Wang (Ohio State Univ.) and Dr. Daniel Schweickart (Air Force Research Lab.)