International Power Suppy-on-Chip Workshop, Taiwan, Oct 17-19, 2018

International Power Supply-on-Chip (PwrSoC) Workshop in Hsinchu, Taiwan, Oct. 17-19, 2018 

Early registration closes September 1st.

And the TSMC tour has limited openings.
We suggest you sign up soon.

This Workshop uniquely spotlights technology and manufacturing advancement of miniaturization and integration of power conversion and power management solutions. The PwrSoC Workshop is the leading international forum for the discussion of the challenges and opportunities, in
technology, business and supply-chain, intent on advancing the miniaturization and integration of power conversion and
power management solutions. The workshop will feature advanced technologies from global academic and industry experts
aimed at miniaturizing power management circuits and passive components.
Initially power supply in a package (PSiP) — but ultimately power supply on chip – (PwrSoC).
Program participants are a 50/50 balance of industry and academia representatives from all major global regions. The Power
Sources Manufacturers Association (PSMA) and IEEE Power Electronics Society (IEEE PELS) are joint sponsors the
workshop. This year’s highlight topics are: Manufacturing, given that Hsinchu, Taiwan, is one of the world’s chief
manufacturing centers low-voltage, wide bandgap (WBG) devices for integrated power management
Professor Cian Ó Mathúna of Tyndall National Institute, the originator of the PwrSoC workshops in 2008 and PwrSoC18’s
General Co-chair, commented on this year’s venue: "Our endeavour is global. We are excited to invite our Asian colleagues
and friends in Hsinchu, a key manufacturing location, to join our workshop participants from around the world to hold this
most important dialogue. Manufacturing as well as technology development are cornerstones to realizing our vision of
enabling a supply-chain to deliver fully integrated PwrSoC to the commercial marketplace."
Professor Hanh-Phuc Le from University of Colorado, Technical Program Chair, pointed out: "We have finally completed our
program and we have a fantastic line up of speakers and topics on our invited presentations and accepted posters. Attendees’
knowledge will be enriched by learning about advancements in converter topologies, passive component technologies, wide-
bandgap devices and circuits and new concepts for integration and manufacturing. World-leading experts will discuss far-
reaching goals and achievements in a wide range of applications, from powering high-performance processors to automotive
and bio-medical systems." 

 

Learn more here!


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