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Packaging and Integration Technology in Wide Band-gap Devices based Power Electronics Converters by Laili Wang

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Laili Wang

Abstract: Compared with Silicon power devices, Wide Band-gap Power Devices have many advantages, such as lower conduction loss, higher operating speed and temperature. Benefiting from these advantages, power density and efficiency of converters could be improved significantly. However, these advantages could not be fully explored because of the limitation of today’s package technology. This speech firstly addresses the challenges we are facing in package and integration of Wide Band-gap Power Devices. Then new technologies are presented to solve the key issues. Finally, corresponding integration technology of passive components are also presented.

 

Bio: Laili Wang (S’07–M’13–SM’15) received the B.S., M.S., and Ph.D. degrees in School of Electrical Engineering, Xi’an Jiaotong University, China in 2004, 2007, and 2011, respectively. Since 2011, he has been a Post-Doctoral Research Fellow in the Electrical Engineering Department, Queen’s University, Canada. From 2014 to 2017, he was an Electrical Engineer with Sumida, Canada. In 2017, he joined in Xi’an Jiaotong University as a full Professor. His research interests include package and integration, wireless power transfer and energy harvesting. Laili Wang serves as an Associate Editor of IEEE Transactions on Power Electronics, IEEE Journal of Emerging and Selected Topics in Power Electronics. He is the vice chair of TC2 (Technical committee of Power Conversion Systems And Components) in PELS, cochair of System Integration and Application in ITRW (International Technology Roadmap for Wide Band-gap Power Semiconductor), Chair of IEEE CPSS&PELS joint Chapter in Xi’an, China.

 

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