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Integrated Power Delivery and Management for High-Performance Digital Systems-SSCS & PELS Joint Webinar
Wednesday, 22 April 2020 11:00 AM ET
Abstract: The need for an efficient power management solution has never been more critical across virtually all electronic devices and systems from low power to high power, smartphones to data centers, battery-powered components to renewable-energy-powered grids, and from stationary systems to aircraft. The key, common challenge for power management in these systems is to satisfy increasingly demanding requirements in terms of efficiency, size, reliability, and cost, simultaneously. This talk will present a unique flow of integrated power converter architectures, topologies, and circuit techniques to address this challenge. Particularly, the speaker will discuss his group research work on a family of hybrid converters that achieve high efficiency for high output power density and current density.
Biography: Dr. Hanh-Phuc Le is Assistant Professor of ECE at the University of California, San Diego. He received the B.S. from Hanoi University of Science and Technology in Vietnam (2004), M.S. from KAIST, Korea (2006), and Ph.D. from UC Berkeley (2013), all in Electrical Engineering. In 2012, he co-founded and served as the CTO at Lion Semiconductor until October 2015. He was with the University of Colorado Boulder from 2016 to 2019, and recently joined the ECE department at UCSD. He also held R&D positions at Oracle, Intel, Rambus, JDA Tech in Korea and the Vietnam Academy of Science and Technology (VAST) in Vietnam. His current research interests include miniaturized/on-die power conversions, large conversion ratios, smart power delivery and control for high performance IT systems, data centers, telecommunication, robots, automotive, mobile, wearable, and IoT applications. Dr. Le received the 2012-2013 IEEE Solid-State Circuits Society Pre-doctoral Achievement Award, and the 2013 Sevin Rosen Funds Award for Innovation at UC Berkeley. He authored two book chapters, over forty journal and conference papers with one best paper award, and is an inventor with 18 U.S. patents (10 granted and 8 pending). He serves as an associate editor of the IEEE Journal of Emerging and Selected Topics in Power Electronics (JESTPE), the TPC chair for the 2018 International Workshop on Power Supply On Chip (PwrSoC 2018), and TPC co-chair for PwrSoC 2020. He is currently the chair of the IEEE Power Electronics Society Technical Committee on Power Conversion Systems and Components (IEEE PELS TC2).
Packaging and Integration Technology in Wide Band-gap Devices based Power Electronics Converters
- Wednesday, 13 May 2020 8:00 AM ET
Presenter: Laili Wang of Xi’an Jiaotong University, China
Abstract: Compared with Silicon power devices, Wide Band-gap Power Devices have many advantages, such as lower conduction loss, higher operating speed and temperature. Benefiting from these advantages, power density and efficiency of converters could be improved significantly. However, these advantages could not be fully explored because of the limitation of today’s package technology. This speech firstly addresses the challenges we are facing in package and integration of Wide Band-gap Power Devices. Then new technologies are presented to solve the key issues. Finally, corresponding integration technology of passive components are also presented.
Biography:Laili Wang (S’07–M’13–SM’15) received the B.S., M.S., and Ph.D. degrees in School of Electrical Engineering, Xi’an Jiaotong University, China in 2004, 2007, and 2011, respectively. Since 2011, he has been a Post-Doctoral Research Fellow in the Electrical Engineering Department, Queen’s University, Canada. From 2014 to 2017, he was an Electrical Engineer with Sumida, Canada. In 2017, he joined in Xi’an Jiaotong University as a full Professor. His research interests include package and integration, wireless power transfer and energy harvesting. Laili Wang serves as an Associate Editor of IEEE Transactions on Power Electronics, IEEE Journal of Emerging and Selected Topics in Power Electronics. He is the vice chair of TC2 (Technical committee of Power Conversion Systems And Components) in PELS, cochair of System Integration and Application in ITRW (International Technology Roadmap for Wide Band-gap Power Semiconductor), Chair of IEEE CPSS&PELS joint Chapter in Xi’an, China.
Conductive Charging of electrified vehicles: Challenges and Opportunities- Joint Webinar with IEEE Transportation Electrification Community
The IEEE PELS Resource Center platform, a new multimedia online library launched in 2016. You may find archived materials such as:
• Conference Presentation Videos and Slides
• Distinguished Lecture Videos and Slides
New and archived content are continuously being added!